Analyses of crack growth along interface of patterned wafer-level cu-cu bonds

DOI10.1016/J.IJSOLSTR.2009.05.015zbMath1167.74579OpenAlexW1991675545MaRDI QIDQ837885

John W. Hutchinson, Viggo Tvergaard

Publication date: 21 August 2009

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2009.05.015

zbMATH Keywords

plasticityfinite strainscrack growththin filmsinterface toughness

Mathematics Subject Classification ID

Fracture and damage (74R99) Thin films (74K35)

Cites Work

• Unnamed Item
• The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
• The influence of plasticity on mixed mode interface toughness
• Thin film delamination: A discrete dislocation analysis
• A Continuum Model for Void Nucleation by Inclusion Debonding

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