Effect of surface condition on boiling heat transfer from silicon chip with submicron-scale roughness
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Publication:856610
DOI10.1016/J.IJHEATMASSTRANSFER.2006.03.045zbMath1113.80311OpenAlexW2072644805MaRDI QIDQ856610
Publication date: 7 December 2006
Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2006.03.045
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