Optimal package design of stacks of convection-cooled printed circuit boards using entropy generation minimization method

DOI10.1016/J.IJHEATMASSTRANSFER.2007.11.041zbMath1148.80355OpenAlexW1972777198MaRDI QIDQ936378

Takahiro Furukawa, Shuichi Torii, Wen-Jei Yang

Publication date: 13 August 2008

Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2007.11.041

Mathematics Subject Classification ID

Optimization problems in thermodynamics and heat transfer (80M50) Forced convection (76R05)

Related Items (1)

Analysis of entropy generation for distributed heating in processing of materials by thermal convection

Cites Work

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• Laminar developing flow and heat transfer between a series of parallel plates with surface mounted discrete heat sources
• Thermal-fluid flow in parallel boards with heat generating blocks.
• Thermal optimization of channel flows with discrete heating sections

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