Thermal ratcheting of solder-bonded elastic and elastoplastic layers
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Publication:939308
DOI10.1016/J.IJPLAS.2007.12.008zbMath1419.74101OpenAlexW2027578367MaRDI QIDQ939308
Ikuo Nakagawa, Masatoshi Tsuda, Yuji Yagi, Takashi Atsumi, Kazuhiko Nakane, Nobutada Ohno
Publication date: 22 August 2008
Published in: International Journal of Plasticity (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijplas.2007.12.008
Small-strain, rate-independent theories of plasticity (including rigid-plastic and elasto-plastic materials) (74C05) Finite element methods applied to problems in solid mechanics (74S05) Thermal effects in solid mechanics (74F05)
Related Items (6)
Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection ⋮ Resetting scheme for plastic strain surface in constitutive modeling of cyclic plasticity ⋮ A self-optimizing inverse analysis method for estimation of cyclic elasto-plasticity model parameters ⋮ Constitutive model for uniaxial transformation ratchetting of super-elastic NiTi shape memory alloy at room temperature ⋮ Meso-mechanical constitutive model for ratchetting of particle-reinforced metal matrix composites ⋮ Uniaxial ratcheting and fatigue failure of tempered 42CrMo steel: Damage evolution and damage-coupled visco-plastic constitutive model
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