Fatigue and fracture assessment for reliability in electronics packaging

DOI10.1007/S10704-008-9224-4zbMATH Open1419.74033OpenAlexW2132304743MaRDI QIDQ944280

Soon-Bok Lee, Ilho Kim, Tae-Sang Park

Publication date: 15 September 2008

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-008-9224-4

zbMATH Keywords

CreepReliabilityFatigueElectronic packageSolder

Mathematics Subject Classification ID

Fracture and damage (74R99) Electromagnetic effects in solid mechanics (74F15) Proceedings, conferences, collections, etc. pertaining to mechanics of deformable solids (74-06) Theories of fracture and damage (74A45)

Cites Work

• A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces

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