A cracked functionally graded piezoelectric material strip under transient thermal loading

DOI10.1007/s00707-007-0561-6zbMath1148.74023OpenAlexW2082938995MaRDI QIDQ954229

Sei Ueda

Publication date: 10 November 2008

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-007-0561-6

zbMATH Keywords

Fourier transformLaplace transformstress intensity factorssingular integral equation

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)

Related Items (11)

Sliding frictional contact analysis of functionally graded piezoelectric layered half-plane ⋮ Thermomagnetic viscoelastic responses in a functionally graded hollow structure ⋮ Enriched element-free Galerkin method for fracture analysis of functionally graded piezoelectric materials ⋮ A comprehensive analysis for the shakedown of a Bree plate made of functionally graded materials ⋮ Thermoelectroelastic response of a functionally graded piezoelectric strip with two parallel axisymmetric cracks ⋮ Stresses distributions in a rotating functionally graded piezoelectric hollow cylinder ⋮ Arc-shaped interfacial crack in a non-homogeneous electro-elastic hollow cylinder with orthotropic dielectric layer ⋮ Bending analysis of FG viscoelastic sandwich beams with elastic cores resting on Pasternak's elastic foundations ⋮ Fracture analysis of Griffith interface crack in fine-grained piezoelectric coating/substrate under thermal loading ⋮ Two parallel penny-shaped or annular cracks in a functionally graded piezoelectric strip under electric loading ⋮ Multi-field coupling solutions of functionally graded two-dimensional piezoelectric quasicrystal wedges and spaces

Cites Work

• Unnamed Item
• Transient response of a piezothermoelastic circular disk under axisymmetric heating
• Three-dimensional transient piezothermoelasticity in functionally graded rectangular plate bonded to a piezoelectric plate
• Stresses in bonded materials with a crack perpendicular to the interface
• A Cracked Piezoelectric Material Strip Under Transient Thermal Loading
• Impermeable Crack and Permeable Crack Assumptions, Which One is More Realistic?
• Numerical Inversion of the Laplace Transform by Use of Jacobi Polynomials

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