Development of a new simulation model of spin coating process and its application to optimize the 450 mm wafer coating process

DOI10.1016/j.ijheatmasstransfer.2010.01.018zbMath1305.76012OpenAlexW2004666264MaRDI QIDQ974890

Junemo Koo, Jung-Yeul Jung, Yong-Tae Kang

Publication date: 8 June 2010

Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.ijheatmasstransfer.2010.01.018

zbMATH Keywords

spin coatingphotoresistphotoresist consumption minimizationwafer enlargement

Mathematics Subject Classification ID

Thin fluid films (76A20)

Related Items (1)

Surface instability of thin polymer resist films with phase change effects on coating flow using numerical approximation techniques

Cites Work

• Flow of a Viscous Liquid on a Rotating Disk

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