Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model
type: Item
instance of: scholarly article
title: Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model
zbMATH Open document ID: 0786.65103
DOI: 10.1016/0377-0427(93)90062-G
author: Baruch Cahlon
author: M. Shillor
author: Irwin E. Schochetman
published in: Journal of Computational and Applied Mathematics
publication date: 1994-01-26T00:00:00Z
review text: For a board of thermally active electronic devices a mathematical model is presented which simulates the evolution of its thermal state. Heat exchange among the components themselves as well as between the components, the edges and a convective flow of cool air is considered, thus giving rise to two discrete systems of equations. The heat exchange between air and board is assumed to satisfy a linear equation. Existence and uniqueness of a steady state solution are proven. Numerical results are obtained by using a non-deterministic scheme, the annealing algorithm.
Mathematics Subject Classification ID: 65Z05
Mathematics Subject Classification ID: 35K05
Mathematics Subject Classification ID: 80A20
zbMATH DE Number: 490553
zbMATH Keywords: convective cooling
zbMATH Keywords: electronic boards
zbMATH Keywords: optimal placement
zbMATH Keywords: numerical results
zbMATH Keywords: annealing algorithm
MaRDI profile type: Publication
cites work: A model for the convective cooling of electronic components with application to optimal placement
cites work: Q3254327
cites work: Electronic System Thermal Design for Reliability
cites work: Convergence of an annealing algorithm
description: scientific article; zbMATH DE number 490553