Mechanics of transonic debonding of a bimaterial interface: The in-plane case
Recent experiments have focused attention on the transonic debonding of a bimaterial interface. Here we discuss the in-plane transonic debonding case. We present complete solutions under conditions of both plane strain and plane stress for an interfacial crack advancing within various velocity regimes below the longitudinal wave speed of the stiffer material component. The stress singularities and the angular stress distributions in different transonic regimes are determined in closed form. The boundedness of energy flow across the interface precludes debonding beyond the higher Rayleigh wave speed.
scientific article; zbMATH DE number 1010630