Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging
type: Item
instance of: scholarly article
title: Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging
zbMATH Open document ID: 1019.80500
DOI: 10.1016/S0307-904X(03)00087-8
author: Yu-Fang Chiu
author: Ying-Ling Tsai
author: Weng-Sing Hwang
published in: Applied Mathematical Modelling
publication date: 2003-08-17T00:00:00Z
Mathematics Subject Classification ID: 80A20
Mathematics Subject Classification ID: 80M20
zbMATH DE Number: 1965125
zbMATH Keywords: Solder joint
zbMATH Keywords: Lead-tin alloy
zbMATH Keywords: Reflow process
zbMATH Keywords: Solidification
zbMATH Keywords: Electronic packaging
MaRDI profile type: Publication
cites work: Effects of the rate of latent heat release on fluid flow and solidification patterns during alloy solidification
full work available at URL: s0307-904x(03)00087-8
OpenAlex ID: W2036698865
description: scientific article; zbMATH DE number 1965125