A thermodynamic model for electrical current induced damage
type: Item
instance of: scholarly article
title: A thermodynamic model for electrical current induced damage
zbMATH Open document ID: 1063.74534
author: Cemal Basaran
author: Minghui Lin
author: Hua Ye
published in: International Journal of Solids and Structures
publication date: 2004-07-12T00:00:00Z
review text: Based on thermodynamics, statistical mechanics, continuum damage mechanics and atomic diffusion, an evolution model is presented for electromigration-induced damage. The model agrees with Black's empirical model, which was obtained from experimental data, where it was shown that the mean time to failure is related to the inverse power of two of the current density. In this paper entropy production due to electromigration is proposed as a damage metric. The proposed damage evolution model includes the effect of electrical field forces, stress gradient effect, vacancy concentration and the thermal gradient.
reviewed by: Messoud Efendiev
Mathematics Subject Classification ID: 74R99
Mathematics Subject Classification ID: 74F15
Mathematics Subject Classification ID: 74A15
zbMATH DE Number: 2078488
zbMATH Keywords: electromigration
zbMATH Keywords: solder joints
zbMATH Keywords: void growth
zbMATH Keywords: nanomechanics
zbMATH Keywords: diffusion
Wikidata QID: Q56338346
MaRDI profile type: Publication
full work available at URL: j.ijsolstr.2003.08.018
OpenAlex ID: W2046340437
DOI: 10.1016/J.IJSOLSTR.2003.08.018
description: scientific article; zbMATH DE number 2078488