Electromigration of intergranular voids in metal films for microelectronic interconnects.
type: Item
instance of: scholarly article
title: Electromigration of intergranular voids in metal films for microelectronic interconnects.
zbMATH Open document ID: 1036.78514
DOI: 10.1016/S0021-9991(03)00070-6
author: Igor Ravve
author: M. Israeli
author: Amir Averbuch
published in: Journal of Computational Physics
publication date: 2003-05-20T00:00:00Z
Mathematics Subject Classification ID: 78M20
Mathematics Subject Classification ID: 78A55
zbMATH DE Number: 1913942
zbMATH Keywords: finite difference scheme
zbMATH Keywords: Runge-Kutta integration scheme
zbMATH Keywords: static Laplace equation
describes a project that uses: SERBA
MaRDI profile type: Publication
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full work available at URL: s0021-9991(03)00070-6
OpenAlex ID: W2011513821
description: scientific article; zbMATH DE number 1913942