Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
type: Item
instance of: scholarly article
title: Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
zbMATH Open document ID: 0964.74073
DOI: 10.1016/S0022-5096(98)00079-9
author: Yanyan Li
published in: Journal of the Mechanics and Physics of Solids
publication date: 2001-07-16T00:00:00Z
Mathematics Subject Classification ID: 74S05
Mathematics Subject Classification ID: 74A50
Mathematics Subject Classification ID: 78A55
zbMATH DE Number: 1419571
zbMATH Keywords: idealized interconnect line
zbMATH Keywords: strain induced roughening
zbMATH Keywords: thin epitaxial film
zbMATH Keywords: three-dimensional finite element method
zbMATH Keywords: electromigration
zbMATH Keywords: surface diffusion
MaRDI profile type: Publication
cites work: Stress singularities along a cycloid rough surface
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cites work: Some general properties of stress-driven surface evolution in a heteroepitaxial thin film structure
cites work: Adaptive remeshing for compressible flow computations
cites work: Modified shape functions for the three-node plate bending element passing the patch test
cites work: A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
full work available at URL: s0022-5096(98)00079-9
OpenAlex ID: W2010765420
description: scientific article; zbMATH DE number 1419571