Thermal analysis of electronic packaging structure using isogeometric boundary element method
type: Item
instance of: scholarly article
title: Thermal analysis of electronic packaging structure using isogeometric boundary element method
author: Huiping Yu
author: Yubo Guo
author: Y. P. Gong
author: Fei Qin
published in: Engineering Analysis with Boundary Elements
publication date: 2021-07-14T00:00:00Z
Mathematics Subject Classification ID: 65-XX
Mathematics Subject Classification ID: 74-XX
zbMATH DE Number: 7371624
zbMATH Keywords: IGABEM
zbMATH Keywords: electronic packaging structure
zbMATH Keywords: radial integration method
zbMATH Keywords: multi-scale property of geometry
zbMATH Keywords: nearly singular integrals
describes a project that uses: BEMECH
MaRDI profile type: Publication
full work available at URL: j.enganabound.2021.04.008
OpenAlex ID: W3154625691
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DOI: 10.1016/J.ENGANABOUND.2021.04.008
description: scientific article; zbMATH DE number 7371624