Mechanics of microelectronics
type: Item
instance of: scholarly article
title: Mechanics of microelectronics
zbMATH Open document ID: 1105.74001
author: Yanyan Li
published in: Solid Mechanics and Its Applications
publication date: 2006-08-17T00:00:00Z
review text: This is an introductory treatise on the mechanics of microelectronics that has penetrated into every aspects of human life for the past half of a century. The authors who are essentially affiliated to Philips Semiconductors and Delft University have made significant contributions to the main topics. The treatise should be of interest to both the academia and industry, and it can be used as a ``basic source for teaching'' in a graduate course. The book comprises nine chapters, each of which has appropriate references and exercises. Chapter 1 (pp. 1--34) ``Microelectronics technology'' by \textit{A. J. van Roosmalen} presents a concise overview of the origin of microelectronics and its evolution into the nanotechnology era, and it provides a view into future directions. Chapter 2 (pp. 35--63) ``Reliability practice'' by \textit{F. G. Kuper} and \textit{X. J. Fan} is devoted to basic concepts of reliability in microelectronics, and introduces the reliability assessments, the basic reliability statistics, the acceleration factor models and failure mechanisms. Chapter 3 (pp. 65--94) ``Thermal management'' by \textit{H. J. Eggink} and \textit{J. H.J. Janssen} gives an introduction into the basics of heat transfer, thermal resistance and thermal design of electronic products. Chapter 4 (pp. 95--167) ``Introduction to advanced mechanics'' by \textit{J. Zhou} and \textit{G. Q. Zhang} serves as a brief introduction to the basics of mechanics needed for the mechanical analysis in microelectronics. The fundamental principles and the equations of thermoelasticity and fracture mechanics, several constitutive laws and some failure criteria are given. The authors also outline the finite element method and its implementation in fracture mechanics. The energy theorems are excluded. Especially, the coupled analysis of mechanical, thermal, electric, moisture and the alike fields is omitted. Chapter 5 (pp. 169--279) ``Thermo-mechanics of integrated circuits and packages'' by \textit{W. …
Mathematics Subject Classification ID: 74-02
Mathematics Subject Classification ID: 74M25
Mathematics Subject Classification ID: 74F05
Mathematics Subject Classification ID: 74Rxx
Mathematics Subject Classification ID: 74S05
zbMATH DE Number: 5047277
zbMATH Keywords: thermal design
zbMATH Keywords: fracture mechanics
zbMATH Keywords: moisture diffusivity
zbMATH Keywords: finite element analysis
reviewed by: M. Cengiz Dökmeci
MaRDI profile type: Publication
description: scientific article