Pages that link to "Item:Q1399667"
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The following pages link to Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667):
Displaying 5 items.
- Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964) (← links)
- Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
- Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (Q2385836) (← links)
- Electromigration failure of metal lines (Q2432249) (← links)
- Numerical simulation of grain-boundary grooving by level set method (Q5943861) (← links)