Pages that link to "Item:Q2134405"
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The following pages link to Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405):
Displaying 9 items.
- Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field (Q669730) (← links)
- A theory for stress-driven interfacial damage upon cationic-selective oxidation of alloys (Q731129) (← links)
- Evolution of penny-shaped microcracks by interface migration. (Q1415800) (← links)
- A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572) (← links)
- A phase field model for failure in interconnect lines due to coupled diffusion mechanisms. (Q1852810) (← links)
- Continuum modeling of charged vacancy migration in elastic dielectric solids, with application to perovskite thin films (Q1939763) (← links)
- Anisotropic phase field solution for morphological evolution and migration of inclusions in piezoelectric films (Q2009940) (← links)
- A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy (Q2205154) (← links)
- A phase field model for the electromigration of intergranular voids (Q2468800) (← links)
