Pages that link to "Item:Q2385899"
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The following pages link to A multi-scale simulation of tungsten film delamination from silicon substrate (Q2385899):
Displaying 6 items.
- Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates (Q399557) (← links)
- The loading history and crystal orientation effects on the size-dependency of single crystal diamond properties (Q836174) (← links)
- Atomistic simulations on the tensile debonding of an aluminum-silicon interface. (Q1582441) (← links)
- A generalized particle in cell method for explicit solid dynamics (Q2021122) (← links)
- A bifurcation-based decohesion model for simulating the transition from localization to decohesion with the MPM (Q2571333) (← links)
- An improved smoothed molecular dynamics method by alternating with molecular dynamics (Q2631481) (← links)