Pages that link to "Item:Q2458797"
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The following pages link to Nanoindentation of Pb/Sn solder alloys; experimental and finite element simulation results (Q2458797):
Displaying 5 items.
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder (Q1764682) (← links)
- Strain gradient finite element model for finite deformation theory: size effects and shear bands (Q2176255) (← links)
- A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects (Q2385826) (← links)
- Grain size dependence of polycrystalline plasticity modeling in cylindrical indentation (Q2666114) (← links)
- Determining Material Parameter of Solder Alloys by Nanoindentation (Q3176929) (← links)