The following pages link to Models of void electromigration (Q2730753):
Displaying 10 items.
- A fitted finite element method for the numerical approximation of void electro-stress migration (Q268875) (← links)
- Finite element approximation of a three dimensional phase field model for void electromigration (Q618416) (← links)
- The isoperimetric inequality via approximation theory and free boundary problems (Q879653) (← links)
- A moving boundary model motivated by electric breakdown. II: Initial value problem (Q989359) (← links)
- Creep flow, diffusion, and electromigration in small scale interconnects (Q1019389) (← links)
- A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572) (← links)
- Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
- A moving boundary problem motivated by electric breakdown. I: Spectrum of linear perturbations (Q2389368) (← links)
- A phase field model for the electromigration of intergranular voids (Q2468800) (← links)
- An unfitted finite element method for the numerical approximation of void electromigration (Q2517475) (← links)