Pages that link to "Item:Q366716"
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The following pages link to Elastic thermal stresses in a circular overlay/rigid substrate system (Q366716):
Displaying 5 items.
- Thermal stresses in bilayer systems with weak interface (Q366562) (← links)
- Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection (Q610410) (← links)
- Biaxial compression of a thin layer with circular debonding over a substrate (Q675654) (← links)
- Thermally induced deformations in a partially coated elastic layer (Q2428229) (← links)
- Thermally induced deformations in die-substrate assembly (Q3649349) (← links)