Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection (Q610410)
From MaRDI portal
| This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use this page instead for the normal view: Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection |
scientific article; zbMATH DE number 5824555
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection |
scientific article; zbMATH DE number 5824555 |
Statements
Thermal ratcheting of solder-bonded layered plates: cyclic recovery and growth of deflection (English)
0 references
8 December 2010
0 references
thermal ratcheting
0 references
layered plates
0 references
constitutive behavior
0 references
cyclic thermal loading
0 references
0 references
0.93114734
0 references
0.83564925
0 references
0.82887137
0 references
0.8282809
0 references
0.82561296
0 references
0.82293624
0 references
0.8218709
0 references
0.82068694
0 references
0.8198089
0 references