Pages that link to "Item:Q388327"
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The following pages link to An Eulerian approach for simulating frictional heating in disc-pad systems (Q388327):
Displaying 6 items.
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601) (← links)
- Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem (Q2194382) (← links)
- The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems (Q2325535) (← links)
- (Q4518633) (← links)
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions (Q6090719) (← links)
- A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems (Q6539835) (← links)