Pages that link to "Item:Q5958742"
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The following pages link to Finite element modeling of a microelectronic structure under uniform thermal loading. (Q5958742):
Displaying 10 items.
- Improved tri-layered interfacial stress model with the effect of different temperatures in the layers (Q363442) (← links)
- Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method (Q535756) (← links)
- Thermal stress and fatigue analysis of plated-through holes using an internal state variable constitutive model (Q1274155) (← links)
- Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages (Q1274164) (← links)
- Applications of FEM for multiple laminated structure in electronic packaging (Q1274174) (← links)
- Analytical elasto-creep model of interfacial thermal stresses and strains in trilayer assemblies (Q2456310) (← links)
- Finite element model analysis of thermal failure in connector (Q2644542) (← links)
- Numerical analysis on thermal characteristics for chip scale package by integrating 2D/3D models (Q3605175) (← links)
- (Q4848934) (← links)
- Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading (Q5051004) (← links)