Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages (Q1274164)
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scientific article; zbMATH DE number 1238234
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages |
scientific article; zbMATH DE number 1238234 |
Statements
Finite element analysis of moisture distribution and hygrothermal stresses in TSOP IC packages (English)
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12 January 1999
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moisture soaking test
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diffusion equations
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0.6730803847312927
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0.6729528307914734
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0.6593689918518066
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