Pages that link to "Item:Q731104"
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The following pages link to Numerical simulations of stress generation and evolution in Volmer-Weber thin films (Q731104):
Displaying 5 items.
- Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (Q442005) (← links)
- Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics (Q994686) (← links)
- Atomistic simulation of stress evolution during island growth (Q1019386) (← links)
- Mechanics of compressive stress evolution during thin film growth (Q1434569) (← links)
- A multiscale coupled finite-element and phase-field framework to modeling stressed grain growth in polycrystalline thin films (Q1674527) (← links)