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Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis - MaRDI portal

Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (Q442005)

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scientific article; zbMATH DE number 6064382
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English
Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis
scientific article; zbMATH DE number 6064382

    Statements

    Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (English)
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    8 August 2012
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    buckle-driven delamination
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    release-and-Bond-back
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    thin films
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    micro/nano-fluidic channels
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    finite element analysis
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