Pages that link to "Item:Q869275"
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The following pages link to Ductility of thin metal films on polymer substrates modulated by interfacial adhesion (Q869275):
Displaying 15 items.
- A strain-isolation design for stretchable electronics (Q362804) (← links)
- Substrate-constrained deformation in thin metal films: numerical case studies (Q373738) (← links)
- Adhesive properties study on the interfaces of aln and metal of pd, ag and cu (Q546508) (← links)
- Dynamic rupture of polymer-metal bilayer plates (Q837428) (← links)
- Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics (Q994686) (← links)
- Predicting deformation-induced polymer-steel interface roughening and failure (Q1657821) (← links)
- Influence of interfacial delamination on channel cracking of elastic thin films (Q1956183) (← links)
- Bifurcation instability of substrate-supported metal films under biaxial in-plane tension (Q2064786) (← links)
- Interfacial behavior of thin film bonded to plastically graded substrate under tensile loading (Q2102604) (← links)
- A multi-scale simulation of tungsten film delamination from silicon substrate (Q2385899) (← links)
- Notch tip fields in amorphous films resting on ductile substrates (Q2421946) (← links)
- Deformability of thin metal films on elastomer substrates (Q2459869) (← links)
- A semi-numerical algorithm for instability of compressible multilayered structures (Q2516441) (← links)
- Necking modes in multilayers and their influence on tearing toughness (Q5136816) (← links)
- Fracture of films caused by uniaxial tensions: a numerical model (Q6542749) (← links)