Pages that link to "Item:Q944280"
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The following pages link to Fatigue and fracture assessment for reliability in electronics packaging (Q944280):
Displaying 3 items.
- A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces (Q2385851) (← links)
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength (Q2459846) (← links)
- Multiphysics Computation of Thermomechanical Fatigue in Electronics Under Electrical Loading (Q5051004) (← links)