Pages that link to "Item:Q1016198"
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The following pages link to Analysis of multiple interfacial cracks in three-dimensional bimaterials using hypersingular integro-differential equation method (Q1016198):
Displaying 11 items.
- Some recent advances in 3D crack and contact analysis of elastic solids with transverse isotropy and multifield coupling (Q314662) (← links)
- Stress intensity factor analyses of three-dimensional interface cracks using tetrahedral finite elements (Q352819) (← links)
- Controlling parameter of the stress intensity factors for a planar interfacial crack in three-dimensional bimaterials (Q833977) (← links)
- Analysis of two intersecting three-dimensional cracks by a BIEM (Q904975) (← links)
- Numerical solutions of singular integral equations for planar rectangular interfacial crack in three dimensional bimaterials (Q940315) (← links)
- Stress intensity factor analysis of a three-dimensional interfacial corner between anisotropic bimaterials under thermal stress (Q994680) (← links)
- An interaction integral method for 3D curved cracks in nonhomogeneous materials with complex interfaces (Q994750) (← links)
- Theoretical analysis of three-dimensional interface crack (Q1297620) (← links)
- Hypersingular integro-partial differential equations for a planar interface crack in bimaterial (Q1814732) (← links)
- Application of hypersingular integral equation method to three-dimensional crack in electromagnetothermoelastic multiphase composites (Q2385235) (← links)
- (Q4846837) (← links)