Pages that link to "Item:Q1021080"
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The following pages link to A finite element model for the analysis of buckling driven delaminations of thin films on rigid substrates (Q1021080):
Displaying 19 items.
- Micron-scale channel formation by the release and Bond-back of pre-stressed thin films: a finite element analysis (Q442005) (← links)
- On thin film delamination growth in a contracting cylinder (Q580023) (← links)
- Evaluation of mechanical parameters of an elastic thin film system by modeling and numerical simulation of telephone cord buckles (Q651924) (← links)
- A novel boundary-domain element method of initial stress, finite deformation and discrete cracks in multilayered anisotropic elastic solids (Q712378) (← links)
- Finite width effect of thin-films buckling on compliant substrate: experimental and theoretical studies (Q731094) (← links)
- Interaction between cracking, delamination and buckling in brittle elastic thin films (Q841923) (← links)
- Dynamic delamination of patterned thin films: a numerical study (Q989726) (← links)
- Dynamic buckling delamination of a bonded thin film under residual compression (Q1310699) (← links)
- A finite element analysis of configurational stability and finite growth of buckling driven delamination (Q1358889) (← links)
- Mode-dependent toughness and the delamination of compressed thin films (Q1584900) (← links)
- Numerical analysis of buckling-driven delamination. (Q1863333) (← links)
- A validated energy approach for the post-buckling design of micro-fabricated thin film devices (Q2337192) (← links)
- Calculations of buckle-driven delamination using cohesive elements (Q2439614) (← links)
- Finite element analysis of ink-tack delamination of paperboard (Q2455872) (← links)
- Buckling delamination in compressed multilayers on curved substrates with accompanying ridge cracks (Q2456891) (← links)
- Modeling nonlinear peeling of ductile thin films -- critical assessment of analytical bending models using FE simulations (Q2567368) (← links)
- Delamination of compressed films on curved substrates (Q5953044) (← links)
- Enhancing toughness of thin films and coatings through embedded nanoinclusions (Q6153004) (← links)
- A shell element for the prediction of residual load-carrying capacities due to delamination (Q6555370) (← links)
