Pages that link to "Item:Q2459293"
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The following pages link to A BEM analysis for thermomechanical closure of interfacial cracks incorporating friction and thermal resistance (Q2459293):
Displaying 14 items.
- BEM calculation of strain energy density and relative strain energy in QWR nanostructures (Q443249) (← links)
- Implementation of the numerical manifold method for thermo-mechanical fracture of planar solids (Q463516) (← links)
- Boundary element analysis of cracked homogeneous or bi-material structures under thermo-mechanical cycling (Q643909) (← links)
- Interface integral BEM for solving multi-medium elasticity problems (Q649316) (← links)
- A new approach for computing hyper-singular interface stresses in IIBEM for solving multi-medium elasticity problems (Q1800193) (← links)
- Thermal fracture interference: a two-dimensional boundary element approach (Q1959857) (← links)
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601) (← links)
- Investigation of thermal-induced damage in fractured rock mass by coupled FEM-DEM method (Q2221161) (← links)
- The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems (Q2325535) (← links)
- Boundary element method applied to three dimensional thermoelastic contact (Q2520277) (← links)
- An interface integral equation method for solving general multi-medium mechanics problems (Q2952967) (← links)
- Thermal stress state of a bimaterial with a closed interfacial crack having rough surfaces (Q3096410) (← links)
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions (Q6090719) (← links)
- A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems (Q6539835) (← links)