Pages that link to "Item:Q2519945"
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The following pages link to Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source (Q2519945):
Displaying 7 items.
- Edge-cracked bimaterial systems under thermal heating (Q546634) (← links)
- Stress intensity factors for bonded two half planes weakened by thermally insulated cracks (Q828231) (← links)
- Interaction between heat dipole and circular interfacial crack (Q1047276) (← links)
- Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159) (← links)
- Two-dimensional steady-state general solution for isotropic thermoelastic materials with applications. II: Green's function for two-phase infinite plane (Q1792322) (← links)
- The effect of interfacial thermal resistance on interface crack subjected to remote heat flux (Q2299231) (← links)
- Interior Cracking of a Circular Inclusion with Imperfect Interface under Thermal Loading (Q4786949) (← links)