Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159)
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scientific article; zbMATH DE number 1238231
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Thermal-mechanical interface crack behaviour of a surface mount solder joint |
scientific article; zbMATH DE number 1238231 |
Statements
Thermal-mechanical interface crack behaviour of a surface mount solder joint (English)
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12 January 1999
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lead-tin solder joint
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large residual shear displacement
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thermal effect
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\(J\)-integral
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0.8471876
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0.8404676
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0.8334389
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0.8333572
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0.82887137
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0.82821435
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0.82777953
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0.8277449
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