Pages that link to "Item:Q2520277"
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The following pages link to Boundary element method applied to three dimensional thermoelastic contact (Q2520277):
Displaying 12 items.
- A systematic solution based on the half-space concept for modeling of thermoelastic contact between bodies defined by curved free boundaries (Q824942) (← links)
- Incremental finite element equations for thermomechanical response of elastomers: Effect of boundary conditions including contact (Q1389796) (← links)
- Analyzing the load distribution of four-row tapered roller bearing with boundary element method (Q1654681) (← links)
- BEM calculation of the complex thermal impedance of microelectronic devices (Q1958304) (← links)
- Stress analysis of three-dimensional contact problems using the boundary element method (Q1961475) (← links)
- Size-dependent contact mechanics via boundary element analysis (Q2118589) (← links)
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601) (← links)
- Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem (Q2194382) (← links)
- The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems (Q2325535) (← links)
- (Q3126655) (← links)
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions (Q6090719) (← links)
- A study of the radiation thermal boundary conditions influence in three-dimensional thermomechanical contact problems (Q6539835) (← links)
