Pages that link to "Item:Q2870379"
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The following pages link to Effect of partial closure of an interfacial crack with heat-conducting filler and surface films under thermal loading of bimaterial (Q2870379):
Displaying 5 items.
- The effect of interfacial thermal resistance on interface crack subjected to remote heat flux (Q2299231) (← links)
- Feeble interfaces in bimaterials (Q2508004) (← links)
- Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source (Q2519945) (← links)
- Thermal stress state of a bimaterial with a closed interfacial crack having rough surfaces (Q3096410) (← links)
- Selected Problems of the Mechanics of Coupled Fields (Q5266619) (← links)