Pages that link to "Item:Q3176035"
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The following pages link to A Numerical Approximation Structured by Mixed Finite Element and Upwind Fractional Step Difference for Semiconductor Device with Heat Conduction and Its Numerical Analysis (Q3176035):
Displaying 8 items.
- Finite difference method and analysis for three-dimensional semiconductor device of heat conduction (Q674709) (← links)
- Numerical method and analysis of computational fluid mechanics for photoelectric semiconducting detector (Q735319) (← links)
- Characteristic finite difference fractional step methods for three-dimensional semiconductor device of heat conduction (Q1428902) (← links)
- A mixed-finite volume element coupled with the method of characteristic fractional step difference for simulating transient behavior of semiconductor device of heat conductor and its numerical analysis (Q1690583) (← links)
- Numerical method of mixed finite volume-modified upwind fractional step difference for three-dimensional semiconductor device transient behavior problems (Q2408873) (← links)
- An approximation of semiconductor device of heat conduction by mixed finite element method and characteristics-mixed finite element method (Q2637092) (← links)
- Modification of upwind finite difference fractional step methods by the transient state of the semiconductor device (Q5451434) (← links)
- An upwind-block-centered finite difference method for a semiconductor device of heat conduction and its numerical analysis (Q6157896) (← links)
