The following pages link to Mechanics of direct wafer bonding (Q3503249):
Displaying 3 items.
- Adhesion and delamination boundary conditions for elastic plates with arbitrary contact shape (Q366440) (← links)
- A model of wafer bonding by elastic accommodation (Q1973600) (← links)
- Residual stress concentration due to nano-scaled particulate contamination at direct bonding interface with localized material inhomogeneity (Q6632187) (← links)