Pages that link to "Item:Q837375"
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The following pages link to Reprint of ``Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates'' [In. J. solids struct. 45 (2008) 2014-2023] (Q837375):
Displaying 11 items.
- A strain-isolation design for stretchable electronics (Q362804) (← links)
- Postbuckling analysis and its application to stretchable electronics (Q443680) (← links)
- Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates (Q957397) (← links)
- Buckling analysis and buckling control of thin films on shape memory polymer substrate (Q1658876) (← links)
- A double perturbation method of postbuckling analysis in 2D curved beams for assembly of 3D ribbon-shaped structures (Q2199433) (← links)
- Dynamic stability analysis of stiff films by element-free method with strain-rotation decomposition (Q2243465) (← links)
- Buckling and postbuckling of a compressed thin film bonded on a soft elastic layer: a three-dimensional analysis (Q2267973) (← links)
- A validated energy approach for the post-buckling design of micro-fabricated thin film devices (Q2337192) (← links)
- A semi-numerical algorithm for instability of compressible multilayered structures (Q2516441) (← links)
- Predicted stresses in die-carrier assemblies in “stretchable” electronics: is there an incentive for using a compliant bond? (Q3076990) (← links)
- Multiscale Buckling and Post-Buckling Analysis: a Comprehensive Review (Q5156575) (← links)
