Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains (Q1290005)
From MaRDI portal
 | This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use this page instead for the normal view: Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains |
scientific article; zbMATH DE number 1296690
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains |
scientific article; zbMATH DE number 1296690 |
Statements
Failure criterion for moisture-sensitive plastic packages of integrated circuit (IC) devices: Application of von-Kármán's equations with consideration of thermoelastic strains (English)
0 references
2 July 2000
0 references
