Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (Q1401103)
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scientific article; zbMATH DE number 1965125
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging |
scientific article; zbMATH DE number 1965125 |
Statements
Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging (English)
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17 August 2003
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Solder joint
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Lead-tin alloy
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Reflow process
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Solidification
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Electronic packaging
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