Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (Q1952390)
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scientific article; zbMATH DE number 6168701
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods |
scientific article; zbMATH DE number 6168701 |
Statements
Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods (English)
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30 May 2013
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Coffin-Manson relation
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creep solder
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microelectronics reliability
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