FAILURE ANALYSIS OF A SEMICONDUCTOR PACKAGING LEADFRAME USING THE SIGNAL PROCESSING APPROACH (Q3556846)
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scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | FAILURE ANALYSIS OF A SEMICONDUCTOR PACKAGING LEADFRAME USING THE SIGNAL PROCESSING APPROACH |
scientific article |
Statements
FAILURE ANALYSIS OF A SEMICONDUCTOR PACKAGING LEADFRAME USING THE SIGNAL PROCESSING APPROACH (English)
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26 April 2010
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un-oxidised leadframe
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oxidised leadframe
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quad flat no-lead
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three-points cyclic bending test
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durability
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