Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (Q416551)
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scientific article; zbMATH DE number 6032592
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging |
scientific article; zbMATH DE number 6032592 |
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Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging (English)
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10 May 2012
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