Solder joint lifetime assessment of electronic devices (Q4398054)
From MaRDI portal
 | This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use this page instead for the normal view: Solder joint lifetime assessment of electronic devices |
scientific article; zbMATH DE number 1174818
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Solder joint lifetime assessment of electronic devices |
scientific article; zbMATH DE number 1174818 |
Statements
22 March 1999
0 references
large strains
0 references
Hencky strain-space description
0 references
eutectic tin-lead solder
0 references
eutectic tin-silver solder
0 references
thermal cycling conditions
0 references
creep damage evolution
0 references
nonlinear triangular finite elements
0 references
Solder joint lifetime assessment of electronic devices (English)
0 references
