Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization (Q4620158)
From MaRDI portal
 | This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use this page instead for the normal view: Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization |
scientific article; zbMATH DE number 7015456
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization |
scientific article; zbMATH DE number 7015456 |
Statements
Optimizing a blend of a mixture slurry in chemical mechanical planarization for advanced semiconductor manufacturing using a posterior preference articulation approach to dual response surface optimization (English)
0 references
8 February 2019
0 references
CMP
0 references
semiconductor
0 references
slurry
0 references
multi-response surface optimization
0 references
dual response surface optimization
0 references
