Analysis of fatigue delamination growth in flip-chip package (Q478321)
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scientific article; zbMATH DE number 6376503
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Analysis of fatigue delamination growth in flip-chip package |
scientific article; zbMATH DE number 6376503 |
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Analysis of fatigue delamination growth in flip-chip package (English)
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3 December 2014
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