A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects (Q6558121)
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scientific article; zbMATH DE number 7867726
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects |
scientific article; zbMATH DE number 7867726 |
Statements
A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects (English)
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18 June 2024
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multi-phase-field model
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anisotropic surface diffusion
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electromigration
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misorientation difference
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crystal orientation
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finite element method
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