Analyses of crack growth along interface of patterned wafer-level cu-cu bonds (Q837885)
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scientific article; zbMATH DE number 5597741
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Analyses of crack growth along interface of patterned wafer-level cu-cu bonds |
scientific article; zbMATH DE number 5597741 |
Statements
Analyses of crack growth along interface of patterned wafer-level cu-cu bonds (English)
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21 August 2009
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interface toughness
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plasticity
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crack growth
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finite strains
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thin films
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0.7179385423660278
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0.6941248774528503
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0.6932141780853271
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0.6912159323692322
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