Pages that link to "Item:Q1019389"
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The following pages link to Creep flow, diffusion, and electromigration in small scale interconnects (Q1019389):
Displaying 8 items.
- Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces (Q833964) (← links)
- A theoretical analysis of the electromigration-induced void morphological evolution under high current density (Q1695572) (← links)
- A phase field model for failure in interconnect lines due to coupled diffusion mechanisms. (Q1852810) (← links)
- Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405) (← links)
- A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy (Q2205154) (← links)
- Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces (Q2385836) (← links)
- Electromigration in Macroscopic Relaxation of Stepped Surfaces (Q3567052) (← links)
- Computation for electromigration in interconnects of microelectronic devices (Q5937908) (← links)
